Intel plans to build a new 300mm wafer semiconductor fabrication facility at its plant in Hillsboro, Oregon, the firm has confirmed.

An Intel spokeswoman said the plant would be in addition to the plants already announced for the Republic and New Mexico.

The 300mm wafer fabrication plants will enable Intel to manufacture chips more efficiently. However, the firm recently halted construction at Leixlip due to slowdown in the technology sector.

Last week, Intel chief executive Mr Craig Barrett said the firm was committed to restarting building work on its Irish plant early next year.